Tekući metal Thermaltake TG-60 Liquid Metal Compound
Kratki opis
High Thermal Conductivity
With a thermal conductivity of 52 W/m-k, the TG-60 liquid metal compound shows a high heat transfer rate better than other thermal compounds, ensuring the best cooling performance.
Even Better Cooling Performance
We’ve
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Opis
High Thermal Conductivity
With a thermal conductivity of 52 W/m-k, the TG-60 liquid metal compound shows a high heat transfer rate better than other thermal compounds, ensuring the best cooling performance.
Even Better Cooling Performance
We’ve also tested TG-60 within our Thermal Chamber running Full Load for 30 minutes on each model under 25? C ambient temperature and 50% humidity. Overclocking 4.8 GHz, we can see that compared to regular thermal compounds, TG-60 shows outstanding cooling performance and can perform even better than liquid metals from other brands.
Specifications:
P/N CL-O034-GROSGM-A/CL-O034-GROSGM-B
THERMAL CONDUCTIVITY 52 W/m-k
ELECTRICAL CONDUCTIVITY 7.28*106 µS/cm
DENSITY 6.2 g/cm3
VISCOSITY 0.0018 Pa-s
THERMAL IMPEDANCE 0.12°C -in2/W
MELTING TEMPERATURE 3°C
WEIGHT 1 g
OPERATING TEMPERATURE 3? ~ 200?
With a thermal conductivity of 52 W/m-k, the TG-60 liquid metal compound shows a high heat transfer rate better than other thermal compounds, ensuring the best cooling performance.
Even Better Cooling Performance
We’ve also tested TG-60 within our Thermal Chamber running Full Load for 30 minutes on each model under 25? C ambient temperature and 50% humidity. Overclocking 4.8 GHz, we can see that compared to regular thermal compounds, TG-60 shows outstanding cooling performance and can perform even better than liquid metals from other brands.
Specifications:
P/N CL-O034-GROSGM-A/CL-O034-GROSGM-B
THERMAL CONDUCTIVITY 52 W/m-k
ELECTRICAL CONDUCTIVITY 7.28*106 µS/cm
DENSITY 6.2 g/cm3
VISCOSITY 0.0018 Pa-s
THERMAL IMPEDANCE 0.12°C -in2/W
MELTING TEMPERATURE 3°C
WEIGHT 1 g
OPERATING TEMPERATURE 3? ~ 200?
