Termalna pasta Thermaltake TG-30 Thermal Compound
Kratki opis
High Thermal Conductivity
The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
Easy to Apply
Thermaltake’s specially formulated thermal compound fits p
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Opis
High Thermal Conductivity
The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
Easy to Apply
Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
Sustainability and Safety
The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use. Non-electrical conductive compound ensures better safety measures for you and your system.
Specifications:
P/N CL-O023-GROSGM-A
THERMAL CONDUCTIVITY 4.5 W/m-k
COLOR Gray
DENSITY 2.55 g/cm3
VISCOSITY 76 Pa-s
THERMAL IMPEDANCE 0.185°C -in2/W
WEIGHT 4g
The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
Easy to Apply
Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
Sustainability and Safety
The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use. Non-electrical conductive compound ensures better safety measures for you and your system.
Specifications:
P/N CL-O023-GROSGM-A
THERMAL CONDUCTIVITY 4.5 W/m-k
COLOR Gray
DENSITY 2.55 g/cm3
VISCOSITY 76 Pa-s
THERMAL IMPEDANCE 0.185°C -in2/W
WEIGHT 4g
